Broadcom Semiconductor Solutions on ICGOODFIND SiteMap
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- Foxconn July Revenue Breaks NT$900B – AI Servers Fuel Historic High
- U.S. Plans Polysilicon Price Floor and Tariffs Under Section 232 – Targeting Semiconductor & Solar Supply Chains
- Memory Prices Hit All-Time Highs in July – Q3 Contract Hikes Slow to 15-20%
- AMEC Targets 60% of High-End Semiconductor Equipment Coverage in 5 Years – Aims for Top Tier by 2035
- Toshiba Rolls Out 40V 120A MOSFET in S-TOGL Package – Low 1.54mΩ RDS(on) for 12V Automotive Systems
- U.S. Awards GlobalFoundries $300M for Silicon Photonics R&D – CPO Push for AI Data Centers
- Acrab Unveils 5nm Edge AI Chip Gelix 1 – 700 TOPS, Runs 100B-Parameter LLMs Locally
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Microchip Acquires Edge AI Chip Firm Hailo – Adds Vision SoCs & AI Accelerators
- STMicro Q2 Revenue Tops $3.49B – AI Data Center Orders Fuel H2 Outlook
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- CXMT LPDDR6 Samples First – 12.8Gbps, Targeting H2 2026 Mass Production
- 3PEAK TPAFEA108 AFE Chip for Optical Modules – 4-Channel IDAC + VDAC with Adaptive Power
- China’s Logic Chips Reach 5nm-Class Performance via DUV Multipatterning, Says SMIC Co-Founder Xie Zhifeng
- China’s First Glass-Substrate CoPoS AI Chip Package Debuts – Xianfeng & Enflame Joint Demo
- PTI & Broadcom Form Singapore JV for Panel-Level Advanced Packaging
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- Micron Expands 1γ LPDDR5X Lineup with 6GB, 12GB, 24GB Non-Binary Options
- TSMC to Hike Mature-Node Wafer Prices – First Adjustment in 3 Years
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- onsemi NCP584HSN12T1G 12V, 2A Low-Dropout Voltage Regulator for High-Performance Applications
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- Kioxia & SanDisk Ship BiCS10 332-Layer 3D NAND Samples – 59% Density Jump
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- Etched Solves AI Throttling with Low-Voltage Design – SRAM+HBM, 80%+ Utilization on Sparse MoE
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- TI Launches Integrated GaN Buck‑Boost Converters for High‑Power Density
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- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
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- Broadcom Q2 Net Income Soars 87.5% to $9.31B, AI Revenue Up 143%
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- Synopsys Rolls Out TSMC N6C/N4C IP Portfolio for Cost‑Optimized AI Chips
- NXP 74LVT162373DGG: 16-Bit Transparent D-Type Latch with 3-State Outputs and 6V Tolerant Inputs/Outputs
- NXP 74HC244DB: Octal Buffer/Line Driver with 3-State Outputs for High-Performance Digital Systems
- NXP BZV55-C39,115 Zener Diode: Key Specifications and Application Circuit Design
- NXP BB202: The Next Generation of Secure UWB Ranging and Connectivity
- Qualcomm Rolls Out IQ10 Robot Reference Design with up to 700 TOPS for Industrial and Humanoid Bots
- The NXP 74HCT390D: A Comprehensive Guide to the Dual Decade Ripple Counter
- NXP BB179B: A Comprehensive Technical Overview of the High-Performance LNA for UHF Applications
- NXP BZV55-B3V0: Zener Diode for Voltage Regulation and Circuit Protection
- The NXP BFU550W is a highly integrated, secure Wi-Fi 6 and Bluetooth® Low Energy 2 module designed specifically for the Internet of Things (IoT). It represents a complete system-in-package (SiP) solut
- Nvidia N1 Series Arm SoC Specs Leak: N1X and N1 Chips for PC Platform
- Samsung Delivers Industry’s First 12‑Stack HBM4E Samples: 48GB, 3.6TB/s
- ChangXin Memory IPO Clears STAR Market Review, Plans $4.1B Raise
- Kingboard Laminate Raises PCB Material Prices by up to 20% as Raw Material Costs Bite
- NXP BYQ28X-200: A Comprehensive Technical Overview of the 200 V Intelligent Power Module
- NXP PDZ1B: The Advanced 1V Zener Diode for Precision Circuit Protection
- Unlocking the Potential of the NXP MKE06Z64VLH4 32-bit Microcontroller for Robust Embedded Systems Design
- NXP BGU7003: A High-Performance GPS Low-Noise Amplifier for Next-Generation Navigation Systems
- NXP 74HC27D: A Comprehensive Technical Overview of the Triple 3-Input NOR Gate IC
- NXP PTN3360BBS: A High-Performance HDMI to DVI Level Shifter and Translator IC
- NXP PMBF170: A Comprehensive Technical Overview of the P-Channel JFET
- NXP BUK765R2-40B: A High-Performance 40 V TrenchMOS MOSFET for Advanced Power Management
- Domestic MEMS Chip‑Level Fan Cools CPU with Near‑Zero Noise – China’s Thermal Breakthrough
- Samsung’s Non‑Chip Workers Seek Court Order Over Vast Pay Gap vs Semiconductor Staff
- Unigroup Guoxin Buys Raynen Semiconductor for $263M to Boost Power Semi IDM
- TSMC Targets Panel‑Level Packaging with CoPoS Platform, Mass Production by 2028
- US FTC Launches Antitrust Probe into Arm Over Licensing Practices
- Power Management IC Prices Rise as Foundry, Assembly Costs Bite – PMIC Makers Set for H2 Upside
- SMIC Q1 Revenue Hits Record $2.505B, Guides 14–16% Growth in Q2
- NXP IP4283CZ10-TBR,115: Advanced ESD Protection for High-Speed Data Interfaces
- NXP MC9S08PA16AVLD: An 8-bit HCS08 Microcontroller for Cost-Sensitive Embedded Applications
- NXP PHT4NQ10T: A Comprehensive Technical Overview of the 40 V, Dual N-Channel TrenchMOS Logic Level FET
- NXP LPC11E14FBD64/401: A Comprehensive Technical Overview of the ARM Cortex-M0 Microcontroller
- NXP LPC804M101JDH20: A Comprehensive Technical Overview of the Arm Cortex-M0+ Based Microcontroller
- NXP PMEG2020EH: A High-Performance Schottky Barrier Diode for Advanced Power Management
- NXP 74ALVC245PW: A Comprehensive Technical Overview and Application Guide
- NXP PSMN0R9-25YLC,115: A Deep Dive into its 8V/25V TrenchMOS MOSFET Technology for High-Efficiency Power Conversion
- Tencent to Boost Domestic AI Chip Usage in H2 2026, Scaling Huawei Ascend and More
- ams OSRAM Sells CMOS Image Sensor Business to indie Semiconductor for €40M
- US Reveals $2.5B Nvidia GPU Smuggling Ring: Bangkok’s OBON Named as ‘Company-1’
- NXP UJA1075ATW/5V0WD: A Comprehensive Overview of the 5V CAN System Basis Chip with Sleep Mode